Bjorn Vandecasteele
Bjorn Vandecasteele
CMST - imec
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ENOBIO dry electrophysiology electrode; first human trial plus wireless electrode system
G Ruffini, S Dunne, E Farrés, Í Cester, PCP Watts, S Ravi, P Silva, C Grau, ...
2007 29th Annual International Conference of the IEEE Engineering in …, 2007
672007
ENOBIO dry electrophysiology electrode; first human trial plus wireless electrode system
G Ruffini, S Dunne, E Farrés, Í Cester, PCP Watts, S Ravi, P Silva, C Grau, ...
2007 29th Annual International Conference of the IEEE Engineering in …, 2007
672007
Enobio-first tests of a dry electrophysiology electrode using carbon nanotubes
G Ruffini, S Dunne, E Farrés, PCP Watts, E Mendoza, SRP Silva, C Grau, ...
2006 International Conference of the IEEE Engineering in Medicine and …, 2006
452006
Flip-chip assembly of semiconductor devices using adhesives
J Vanfleteren, S Stoukach, B Vandecasteele
US Patent 6,555,414, 2003
382003
Arbitrarily shaped 2.5 d circuits using stretchable interconnects embedded in thermoplastic polymers
B Plovie, Y Yang, J Guillaume, S Dunphy, K Dhaenens, S Van Put, ...
Advanced Engineering Materials 19 (8), 1700032, 2017
232017
Comparison of different flex materials in high density flip chip on flex applications
P Palm, J Määttänen, Y De Maquillé, A Picault, J Vanfleteren, ...
Microelectronics Reliability 43 (3), 445-451, 2003
222003
Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
G Vakanas, O Minho, B Dimcic, K Vanstreels, B Vandecasteele, ...
Microelectronic Engineering 140, 72-80, 2015
202015
Arbitrarily shaped 2.5 D circuits using stretchable interconnections and embedding in thermoplastic polymers
J Vanfleteren, I Chtioui, B Plovie, Y Yang, F Bossuyt, T Vervust, S Dunphy, ...
Procedia Technology 15, 208-215, 2014
172014
3D Multifunctional Composites Based on Large‐Area Stretchable Circuit with Thermoforming Technology
Y Yang, T Vervust, S Dunphy, S Van Put, B Vandecasteele, K Dhaenens, ...
Advanced Electronic Materials 4 (8), 1800071, 2018
152018
Adhesive bonding by SU-8 transfer for assembling microfluidic devices
P Salvo, R Verplancke, F Bossuyt, D Latta, B Vandecasteele, C Liu, ...
Microfluidics and nanofluidics 13 (6), 987-991, 2012
132012
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ...
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
92017
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
M Cauwe, B Vandecasteele, J De Baets, J van den Brand, R Kusters, ...
2012 4th Electronic System-Integration Technology Conference, 1-6, 2012
72012
Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application
J Vanfleteren, B Vandecasteele, T Podprocky
4th Electronics Packaging Technology Conference, 2002., 139-143, 2002
72002
Reliability of different flex materials in high density flip chip on flex applications
P Palm, J Maattanen, Y De Maquillé, A Picault, J Vanfleteren, ...
First International IEEE Conference on Polymers and Adhesives in …, 2001
72001
2.5 D smart objects using thermoplastic stretchable interconnects
B Plovie, S Dunphy, K Dhaenens, S Van Put, B Vandecasteele, F Bossuyt, ...
International Symposium on Microelectronics 2015 (1), 000868-000873, 2015
62015
Polyimide based embedding technology for RF structures and active components
W Christiaens, B Vandevelde, S Brebels, J Vanfleteren
Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium …, 2007
52007
Sn whisker evaluations in 3D microbumped structures
GP Vakanas, B Vandecasteele, D Schaubroek, J De Messemaeker, ...
Microelectronics Reliability 54 (9-10), 1982-1987, 2014
42014
Development of an active high-density transverse intrafascicular micro-electrode probe
R Verplancke, M Cauwe, D Schaubroeck, D Cuypers, B Vandecasteele, ...
Journal of Micromechanics and Microengineering 30 (1), 015010, 2019
32019
A Ka‐band SiGe BICMOS power amplifier with 24 dBm output power
R Pierco, G Torfs, T De Keulenaer, B Vandecasteele, J Missinne, ...
Microwave and Optical Technology Letters 57 (3), 718-722, 2015
32015
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
G Vakanas, B Dimcic, B Vandecasteele, K Vanstreels, J De Messemaeker, ...
23rd Conference on Materials for Advanced Metallization-MAM, Date: 2014/01 …, 2014
32014
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