| A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ... Nanotechnology 23 (4), 045304, 2012 | 94 | 2012 |
| Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling N Nabiollahi, N Moelans, M Gonzalez, J De Messemaeker, CJ Wilson, ... Microelectronics reliability 55 (5), 765-770, 2015 | 19 | 2015 |
| Impact of oxide liner properties on TSV Cu pumping and TSV stress J De Messemaeker, OV Pedreira, A Moussa, N Nabiollahi, K Vanstreels, ... 2015 IEEE International Reliability Physics Symposium, 4C. 5.1-4C. 5.10, 2015 | 14 | 2015 |
| A holistic view on sustainability in additive and subtractive manufacturing: A comparative empirical study of eyewear production systems S Solaimani, A Parandian, N Nabiollahi Sustainability 13 (19), 10775, 2021 | 11 | 2021 |
| Simulation of Cu pumping during TSV fabrication N Nabiollahi, CJ Wilson, J De Messemaeker, M Gonzalez, K Croes, ... Thermal, Mechanical and Multi-Physics Simulation and Experiments in …, 2013 | 10 | 2013 |
| Impact of Cu TSVs on BEOL metal and dielectric reliability Y Li, K Croes, N Nabiollahi, S Van Huylenbroeck, M Gonzalez, D Velenis, ... 2014 IEEE International Reliability Physics Symposium, 3E. 1.1-3E. 1.5, 2014 | 9 | 2014 |
| FEM simulation of bimodal and trimodal thermally conductive adhesives N Nabiollahi, J Liu, Z Hilli, Y Zhang, Y Cong, Z Cheng, M Inoue 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO), 422-425, 2009 | 1 | 2009 |
| A Holistic View on Sustainability in Additive and Subtractive Manufacturing: A Comparative Empirical Study. Sustainability 2021, 13, 10775 S Solaimani, A Parandian, N Nabiollahi s Note: MDPI stays neu-tral with regard to jurisdictional claims in …, 2021 | | 2021 |
| Processing Induced Changes of Mechanical Stresses in and near Cu Through Silicon Vias (TSVs): A Finite Element Modelling Study N Nabiollahi | | 2017 |
| A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity F Yifeng, N Nabiollahi, W Teng, H Zhili, B Carlberg, J Liu, W Shun, Z Yan, ... Nanotechnology (Print) 23, 2012 | | 2012 |
| Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems T Wang, N Nabiollahi, K Jeppson, J Liu CD Proceedings of the Annual World Conference on Carbon, ECUST, Shanghai …, 2011 | | 2011 |
| 3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler N Nabiollahi, Y Fu, J Liu IMAPS Nordic Annual Conference 2010, Proceedings, 44-47, 2010 | | 2010 |
