| Modeling the glass transition of amorphous networks for shape-memory behavior R Xiao, J Choi, N Lakhera, CM Yakacki, CP Frick, TD Nguyen Journal of the Mechanics and Physics of Solids 61 (7), 1612-1635, 2013 | 123 | 2013 |
| Partially constrained recovery of (meth) acrylate shape‐memory polymer networks N Lakhera, CM Yakacki, TD Nguyen, CP Frick Journal of Applied Polymer Science 126 (1), 72-82, 2012 | 57 | 2012 |
| Characterization of indentation size effects in epoxy F Alisafaei, CS Han, N Lakhera Polymer testing 40, 70-78, 2014 | 53 | 2014 |
| Unique recovery behavior in amorphous shape‐memory polymer networks CM Yakacki, AM Ortega, CP Frick, N Lakhera, R Xiao, TD Nguyen Macromolecular Materials and Engineering 297 (12), 1160-1166, 2012 | 32 | 2012 |
| Thermo-mechanical behavior and structure of melt blown shape-memory polyurethane nonwovens DL Safranski, JM Boothby, CN Kelly, K Beatty, N Lakhera, CP Frick, A Lin, ... Journal of the Mechanical Behavior of Biomedical Materials 62, 545-555, 2016 | 27 | 2016 |
| Effect of viscoelasticity on the spherical and flat adhesion characteristics of photopolymerizable acrylate polymer networks N Lakhera, A Graucob, AS Schneider, E Kroner, E Arzt, CM Yakacki, ... International Journal of Adhesion and Adhesives 44, 184-194, 2013 | 26 | 2013 |
| Biodegradable thermoset shape‐memory polymer developed from poly (β‐amino ester) networks N Lakhera, CM Laursen, DL Safranski, CP Frick Journal of Polymer Science Part B: Polymer Physics 50 (11), 777-789, 2012 | 24 | 2012 |
| Amorphous-to-crystalline transition of Polyetheretherketone–carbon nanotube composites via resistive heating AC Martin, N Lakhera, AL DiRienzo, DL Safranski, AS Schneider, ... Composites Science and Technology 89, 110-119, 2013 | 18 | 2013 |
| Selectively shielded semiconductor package AK Singh, N Lakhera, NKO Kalandar US Patent App. 15/719,668, 2019 | 15 | 2019 |
| Repassivation behaviour of stressed aluminium electrodes in aqueous chloride solutions C Mi, N Lakhera, DA Kouris, DA Buttry Corrosion science 54, 10-16, 2012 | 11 | 2012 |
| Adhesion behavior of polymer networks with tailored mechanical properties using spherical and flat contacts N Lakhera, A Graucob, AS Schneider, E Kroner, M Micciché, E Arzt, ... MRS Communications 3 (1), 73-77, 2013 | 10 | 2013 |
| Systematic tailoring of water absorption in photopolymerizable (meth) acrylate networks and its effect on mechanical properties N Lakhera, KE Smith, CP Frick Journal of applied polymer science 128 (3), 1913-1921, 2013 | 9 | 2013 |
| Electronic component package with heatsink and multiple electronic components NKO Kalandar, AK Singh, N Lakhera US Patent 9,953,904, 2018 | 8 | 2018 |
| Apparatus and Methods for Multi-Die Packaging N Lakhera, NKO Kalandar, AK Singh US Patent App. 15/080,162, 2017 | 7 | 2017 |
| Stackable molded packages and methods of manufacture thereof AK Singh, N Lakhera, NKO Kalandar US Patent App. 15/237,827, 2018 | 5 | 2018 |
| Die attachment for packaged semiconductor device AK Singh, RI Hegde, N Lakhera US Patent 9,559,077, 2017 | 5 | 2017 |
| On thresholds in the indentation size effect of polymers AN Bucsek, F Alisafaei, CS Han, N Lakhera Polymer Bulletin 73, 763-772, 2016 | 5 | 2016 |
| Advanced fan out wafer level package development for small form factor and high-performance microcontroller applications G Sharma, N Lakhera, M Benson, AJ Mawer 2019 International Wafer Level Packaging Conference (IWLPC), 1-6, 2019 | 4 | 2019 |
| Coupled Thermal and Thermo-Mechanical Simulation for Flip-chip Component Level Copper Pillar Bump Fatigue S Shantaram, ARN Sakib, N Lakhera 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 4 | 2018 |
| Thermally switchable adhesion of photopolymerizable acrylate polymer networks-biomed 2013. N Lakhera, A Graucob, A Schneider, E Kroner, CM Yakacki, CP Frick Biomedical Sciences Instrumentation 49, 141-148, 2013 | 4 | 2013 |
