| Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade Microelectronics Reliability 50 (9-11), 1768-1772, 2010 | 44 | 2010 |
| Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity T Youssef, W Rmili, E Woirgard, S Azzopardi, N Vivet, D Martineau, ... Microelectronics Reliability 55 (9-10), 1997-2002, 2015 | 39 | 2015 |
| Universal mechanisms of Al metallization ageing in power MOSFET devices D Martineau, C Levade, M Legros, P Dupuy, T Mazeaud Microelectronics Reliability 54 (11), 2432-2439, 2014 | 38 | 2014 |
| Characterization of ageing failures on power MOSFET devices by electron and ion microscopies D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade, ... Microelectronics Reliability 49 (9-11), 1330-1333, 2009 | 35 | 2009 |
| 2 MHz high-density integrated power supply for gate driver in high-temperature applications R Perrin, B Allard, C Buttay, N Quentin, W Zhang, R Burgos, D Boroyevic, ... 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 524-528, 2016 | 24 | 2016 |
| Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard Microelectronics Reliability 64, 409-414, 2016 | 21 | 2016 |
| Identification and analysis of power substrates degradations subjected to severe aging tests E Woirgard, F Arabi, W Sabbah, D Martineau, L Theolier, S Azzopardi Microelectronics Reliability 55 (9-10), 1961-1965, 2015 | 14 | 2015 |
| Numerical and experimental results correlation during power MOSFET ageing T Azoui, P Tounsi, P Dupuy, JM Dorkel, D Martineau 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 14 | 2012 |
| Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device E Marcault, M Breil, A Bourennane, P Tounsi, D Martineau, P Dupuy Proceedings of the 2011 14th European Conference on Power Electronics and …, 2011 | 7 | 2011 |
| Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB F Arabi, T Youssef, M Coudert, G Coquery, N Alayli, D Martineau, ... Microelectronics Reliability 114, 113900, 2020 | 6 | 2020 |
| Direct printing of heat sinks, cases and power connectors on insulated substrate using selective laser melting techniques R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2173-2179, 2019 | 6 | 2019 |
| Thermo-mechanical reliability assessment of AlN power substrates subjected to severe aging tests F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard Materials Focus 6 (3), 352-358, 2017 | 6 | 2017 |
| Caractérisation de l'endommagement de composants électroniques de puissance soumis à des tests de vieillissement accéléré D Martineau Toulouse, INSA, 2011 | 6 | 2011 |
| Joining using reactive films for electronic applications: impact of applied pressure and assembled materials properties on the joint initial quality R Khazaka, D Martineau, S Azzopardi Journal of Electronic Materials 47, 7053-7061, 2018 | 5 | 2018 |
| Design of a GaN HEMT based inverter leg power module for aeronautic applications B Thollin, F Zaki, Z Khatir, R Meuret, D Martineau, C Fita, PO Jeannin, ... 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016 | 5 | 2016 |
| Multi-physics modelling of thin films: optimization for finite elements simulations tools T Youssef, E Woirgard, S Azzopardi, D Martineau, R Meuret 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 5 | 2015 |
| Evaluation of direct printed heat sinks on metallized ceramic substrate for high-performance power modules R Khazaka, E Martin, J Alexis, D Martineau, S Azzopardi IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 4 | 2021 |
| Rapid and localized soldering using reactive films for electronic applications R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi Journal of Microelectronics and Electronic Packaging 16 (4), 182-187, 2019 | 2 | 2019 |
| Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts E Martin, R Khazaka, D Martineau, S Azzopardi, J Alexis CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 1 | 2020 |
| A multiphysics cosimulation for a wide band gap power module fatigue-related performance assessment B Boulbene, D Martineau, E Woirgard, R Meuret, T Youssef, D Balland NAFEMS Americas Conference, The International Association for the …, 2016 | 1 | 2016 |
Stéphane AzzopardiAss. Prof. (HDR) - IMS Laboratory - Bordeaux Institute of TechnologyDirección de correo verificada de bordeaux-inp.fr
