| Low capacitance through-silicon-vias with uniform benzocyclobutene insulation layers Q Chen, C Huang, Z Tan, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 56 | 2013 |
| Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs) Q Chen, C Huang, Z Wang Microelectronics Reliability 52 (11), 2670-2676, 2012 | 40 | 2012 |
| Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers Q Chen, C Huang, D Wu, Z Tan, Z Wang IEEE TRANSACTIONS ON ELECTRON DEVICES 60 (4), 1421, 2013 | 38 | 2013 |
| High Aspect Ratio and Low Capacitance Through-Silicon-Vias (TSVs) with Polymer Insulation Layers C Huang, Q Chen, D Wu, Z Wang Microelectronic Engineering, 2012 | 36 | 2012 |
| Air-gap through-silicon vias C Huang, Q Chen, Z Wang IEEE electron device letters 34 (3), 441-443, 2013 | 33 | 2013 |
| Air-Gap Through-Silicon Vias C Huang, Q Chen, Z Wang IEEE, 0 | 33 | |
| Polymer liner formation in high aspect ratio through-silicon-vias for 3-D integration C Huang, Q Chen, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 20 | 2013 |
| Thermal and electrical properties of BCB-liner through-silicon vias C Huang, L Pan, R Liu, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 18 | 2014 |
| Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang Q Chen, W Yu, C Huang, Z Tan, Z Wang Microelectronics Reliability, 2013 | 18* | 2013 |
| Implementation of air-gap through-silicon-vias (TSVs) using sacrificial technology C Huang, Q Chen, D Wu, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8 …, 2013 | 17 | 2013 |
| Thermal and electrical reliability tests of air-gap through-silicon vias C Huang, R Liu, Z Wang IEEE Transactions on Device and Materials Reliability 15 (1), 90-100, 2014 | 9 | 2014 |
| Thermal and electrical tests of air-gap TSV C Huang, D Wu, Z Wang 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1722-1728, 2014 | 8 | 2014 |
| Planarization of high topography surfaces with deep holes and cavities using two-step polymer coating C Huang, Z Wang Sensors and Actuators A: Physical 213, 94-101, 2014 | 7 | 2014 |
| Low-Capacitance Through-Silicon-Vias With Combined Air/SiO2Liners C Huang, K Wu, Z Wang IEEE Transactions on Electron Devices 63 (2), 739-745, 2015 | 6 | 2015 |
| Mechanical reliability testing of air-gap through-silicon vias C Huang, K Wu, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (5 …, 2016 | 5 | 2016 |
| Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner Q Chen, C Huang, Z Wang 2013 IEEE 63rd Electronic Components and Technology Conference, 1433-1438, 2013 | 4 | 2013 |
| Air-gap/SiO2 liner TSVs with improved electrical performance C Huang, D Wu, L Pan, Z Wang 2015 International 3D Systems Integration Conference (3DIC), TS8. 7.1-TS8. 7.5, 2015 | 2 | 2015 |
| Thermal Reliability Tests of Air-Gap TSVs With Combined Air-SiO2Liners C Huang, D Wu, Z Wang IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (5 …, 2016 | 1 | 2016 |
| CASPASE 8 AND RIP3 ARE NOT REQUIRED FOR NUCLEAR REPROGRAMMING AND DIFFERENTIATION D Wu, N Sayed, C Huang, JP Cooke, E Mocarski JOURNAL OF INVESTIGATIVE MEDICINE 64 (2), 634-634, 2016 | | 2016 |
| Measurement and simulation of high voltage-wake interactions DA Hardy, D Olsen, WJ Burke, G Ginet, P Gough, C Huang, HG James IEEE Conference Record-Abstracts. 1996 IEEE International Conference on …, 1996 | | 1996 |
Qianwen ChenInsititute of Microelectronic, Tsinghua UniversityDirección de correo verificada de mail.tsinghua.edu.cn
