Get my own profile
Public access
View all58 articles
2 articles
available
not available
Based on funding mandates
Co-authors
- Evgeny PodryabinkinSkolkovo Institute of Science and TechnologyVerified email at skoltech.ru
- Bohayra MortazaviLeibniz Universität HannoverVerified email at iop.uni-hannover.de
- Xiaoying ZhuangERC Project Awardee, Leibniz University HanoverVerified email at iop.uni-hannover.de
- Timon RabczukBauhaus University WeimarVerified email at uni-weimar.de
- Ivan NovikovSenior Research Scientist, Skolkovo Institute of Science and TechnologyVerified email at skoltech.ru
- Jörg NeugebauerDirector, Max-Planck-Institut für EisenforschungVerified email at mpie.de
- Fritz KörmannUniversity of Stuttgart, ICAMS Bochum, MPIE DüsseldorfVerified email at mpie.de
- Gus L. W. HartBrigham Young University, Physics and AstronomyVerified email at byu.edu
- Evgenii TsymbalovApptekVerified email at apptek.com
- Gabor CsanyiProfessor of Molecular Modelling, Engineering Laboratory, University of CambridgeVerified email at cam.ac.uk
- Christoph OrtnerUniversity of British ColumbiaVerified email at math.ubc.ca
- Blazej GrabowskiInstitute for Materials Science, University of StuttgartVerified email at imw.uni-stuttgart.de
- Mitchell LuskinProfessor of Mathematics, University of MinnesotaVerified email at umn.edu
- Ming DaoMassachusetts Institute of TechnologyVerified email at mit.edu
- Stephan RocheICREA Research Professor, Catalan Institute of Nanoscience and NanotechnologyVerified email at icn2.cat
- Conrad RosenbrockBrigham Young UniversityVerified email at byu.edu
- Brahmanandam JavvajiPostdoc Scientific Coworker, Chair of Computational Science and Simulation Technology, Insisute ofVerified email at iop.uni-hannover.de
- Alexander G. KvashninFull Professor, Skolkovo Institute of Science and TechnologyVerified email at skoltech.ru
- Zhe ShiApple Inc., Massachusetts Institute of TechnologyVerified email at mit.edu
- Ju LiProfessor of Nuclear Science and Engineering and Materials Science and Engineering, MIT, USAVerified email at mit.edu