| Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition Y Chen, W He, X Chen, C Wang, Z Tao, S Wang, G Zhou, ... Electrochimica Acta 120, 293-301, 2014 | 95 | 2014 |
| Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum Y Hong, Y Li, L Huang, W He, S Wang, C Wang, G Zhou, Y Chen, X Zhou, ... Journal of Biophotonics 13 (4), e201960176, 2020 | 60 | 2020 |
| A comparison of typical additives for copper electroplating based on theoretical computation Z Lai, S Wang, C Wang, Y Hong, G Zhou, Y Chen, W He, Y Peng, D Xiao Computational Materials Science 147, 95-102, 2018 | 60 | 2018 |
| Computational analysis and experimental evidence of two typical levelers for acid copper electroplating Z Lai, S Wang, C Wang, Y Hong, Y Chen, H Zhang, G Zhou, W He, K Ai, ... Electrochimica Acta 273, 318-326, 2018 | 59 | 2018 |
| Properties and application of polyimide‐based composites by blending surface functionalized boron nitride nanoplates Y Chen, X Gao, J Wang, W He, VV Silberschmidt, S Wang, Z Tao, H Xu Journal of Applied Polymer Science 132 (16), 2015 | 57 | 2015 |
| Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole L Zheng, W He, K Zhu, C Wang, S Wang, Y Hong, Y Chen, G Zhou, ... Electrochimica Acta 283, 560-567, 2018 | 53 | 2018 |
| Copolymer of pyrrole and 1, 4-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating J Li, G Zhou, Y Hong, C Wang, W He, S Wang, Y Chen, Z Wen, Q Wang ACS omega 5 (10), 4868-4874, 2020 | 45 | 2020 |
| Optoplasmonic hybrid materials for trace detection of methamphetamine in biological fluids through SERS Y Hong, X Zhou, B Xu, Y Huang, W He, S Wang, C Wang, G Zhou, Y Chen, ... ACS applied materials & interfaces 12 (21), 24192-24200, 2020 | 44 | 2020 |
| Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing Y Wang, Y Hong, G Zhou, W He, Z Gao, S Wang, C Wang, Y Chen, ... ACS applied materials & interfaces 11 (47), 44811-44819, 2019 | 38 | 2019 |
| Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates Y Chen, Y Chen, J Wang, K Zhu, L Jia, S Wang, W He, Q Chen, H Miao, ... Composites Part B: Engineering 158, 400-405, 2019 | 29 | 2019 |
| Improved uniformity of conformal through-hole copper electrodeposition by revision of plating cell configuration L Ji, SX Wang, C Wang, G Chen, Y Chen, W He, Z Tan Journal of The Electrochemical Society 162 (12), D575, 2015 | 29 | 2015 |
| Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board Y Hong, X You, Y Zeng, Y Chen, Y Huang, W He, S Wang, C Wang, ... Vacuum 170, 108967, 2019 | 23 | 2019 |
| Electrochemical factors of levelers on plating uniformity of through-holes: simulation and experiments J Xiang, S Wang, J Li, W He, C Wang, Y Chen, H Zhang, H Miao, J Zhou, ... Journal of the electrochemical society 165 (9), E359, 2018 | 23 | 2018 |
| Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence Z Lai, C Wang, Y Huang, Y Chen, S Wang, Y Hong, G Zhou, W He, X Su, ... Materials Today Communications 24, 100973, 2020 | 22 | 2020 |
| Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles J Li, G Zhou, X Jin, Y Hong, W He, S Wang, Y Chen, W Yang, X Su Composites Part B: Engineering 154, 257-262, 2018 | 21 | 2018 |
| Initiation electroless nickel plating by atomic hydrogen for PCB final finishing J Lin, C Wang, S Wang, Y Chen, W He, D Xiao Chemical Engineering Journal 306, 117-123, 2016 | 21 | 2016 |
| Whisker inhibited Sn–Bi alloy coating on copper surface to increase copper bonding strength for signal loss reduction of PCB in high-frequency G Zhou, Y Tao, W He, S Wang, Y Hong, CY Chen, Y Chen, C Wang, C Ma, ... Applied Surface Science 513, 145718, 2020 | 20 | 2020 |
| Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition Y Chen, D Yan, X Jin, Y Zeng, D Zhang, Z Liu, W He, S Wang, Z Wang, ... Applied Surface Science 491, 206-215, 2019 | 19 | 2019 |
| Convection-dependent competitive adsorption between SPS and EO/PO on copper surface for accelerating trench filling K Zhu, C Wang, J Wang, Y Hong, Y Chen, W He, J Zhou, H Miao, Q Chen Journal of The Electrochemical Society 166 (4), D93, 2019 | 19 | 2019 |
| Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates J Xiang, C Wang, Y Chen, S Wang, Y Hong, H Zhang, L Gong, W He Applied Surface Science 411, 82-90, 2017 | 18 | 2017 |
