Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding SW Kim, F Fodor, N Heylen, S Iacovo, J De Vos, A Miller, G Beyer, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 216-222, 2020
67 2020 Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects P Absil, K Croes, A Lesniewska, P De Heyn, Y Ban, B Snyder, J De Coster, ...
2017 IEEE International Electron Devices Meeting (IEDM), 34.2. 1-34.2. 4, 2017
50 2017 Language geostrategy in eastern and central Europe: Assessment and perspectives F Fodor, S Peluau
Languages in a globalising world, 85-98, 2003
41 2003 Accès à l'énergie en Europe F Bafoil, F Fodor, D Le Roux
HAL Post-Print, 2014
23 2014 High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package D Velenis, A Phommahaxay, P Bex, F Fodor, EJ Marinissen, K Rebibis, ...
2018 International Wafer Level Packaging Conference (IWLPC), 1-5, 2018
16 2018 Demonstration of a collective hybrid die-to-wafer integration S Suhard, A Phommahaxay, K Kennes, P Bex, F Fodor, M Liebens, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1315-1321, 2020
15 2020 Demonstration of a collective hybrid die-to-wafer integration using glass carrier S Suhard, K Kennes, P Bex, A Jourdain, L Teugels, E Walsby, C Bolton, ...
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2064-2070, 2021
13 2021 A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards EJ Marinissen, F Fodor, B De Wächter, J Kiesewetter, E Hill, K Smith
2017 International Test Conference in Asia (ITC-Asia), 144-149, 2017
12 2017 L'énergie éolienne en Europe. Conflits, démocratie, acceptabilité sociale F Bafoil, A Bonnet, M Dąbrowski, M Dicko, F Fodor, R Guyet, F Lamari, ...
HAL Post-Print, 2016
12 2016 Climat d'angoisse: l'imaginaire du changement climatique F Fodor
Les 2 Encres, 2011
11 2011 Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits EJ Marinissen, F Fodor, A Podpod, M Stucchi, YR Jian, CW Wu
2018 IEEE International Test Conference (ITC), 1-10, 2018
10 2018 New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding J De Messemaeker, L Witters, B Zhang, YW Tsau, F Fodor, J De Vos, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 109-113, 2023
7 2023 Multi-tier Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology S Van Huylenbroeck, J De Vos, L Teugels, S Iacovo, F Fodor, A Miller, ...
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1057-1062, 2021
5 2021 Dynamique des imaginaires linguistiques dans la constitution des langues nationales européennes: le cas du français et du hongrois F Fodor
Paris 5, 1999
5 1999 „Le récit d'un «drame» possible: la mise en discours de la grippe aviaire dans la presse française” F Fodor
Dire l’événement, ed. Sophie Moirand, Sandrine Reboul-Touré, Danielle Londei …, 2013
4 2013 Les jeunes face au changement climatique dans l’imaginaire romanesque F Fodor
Communication & langages, 83-95, 2012
4 2012 Testing embedded toggle pattern generation through on-chip IR drop monitoring K Monta, L Kataselas, F Fodor, A Hatzopoulos, M Nagata, EJ Marinissen
2021 IEEE European Test Symposium (ETS), 1-4, 2021
3 2021 Leading-edge wide-I/O2 memory probing challenges: TPEG (TM) MEMS solution F Fodor, EJ Marinissen, D Acconcia, R Vallauri
3 2018 L'imaginaire des langues chez Meillet ou la contamination de l'univers discursif scientifique par le politique et l'intime F Fodor
Dossiers d'HEL, 10, 2014
3 2014 L’imaginaire de l’épidémie F Fodor
Les mots de la santé 3, 2011
3 2011