Petar Ratchev
Petar Ratchev
Constellium C-TEC
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Precipitation hardening of anAl–4.2 wt% Mg–0.6 wt% Cu alloy
P Ratchev, B Verlinden, P De Smet, P Van Houtte
Acta materialia 46 (10), 3523-3533, 1998
1771998
Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages
B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne
5th International Conference on Thermal and Mechanical Simulation and …, 2004
1422004
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
P Ratchev, S Stoukatch, B Swinnen
Microelectronics Reliability 46 (8), 1315-1325, 2006
952006
A comparative study of two Al-Mg-Si alloys for automotive applications
T Moons, P Ratchev, B Verlinden, P Van Houtte, P De Smet
Scripta Materialia 35 (8), 1996
771996
Study of the temperature dependence of the bainitic transformation rate in a multiphase TRIP-assisted steel
E Girault, P Jacques, P Ratchev, J Van Humbeeck, B Verlinden, ...
Materials Science and Engineering: A 273, 471-474, 1999
711999
Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish
P Ratchev, B Vandevelde, I De Wolf
IEEE Transactions on Device and Materials Reliability 4 (1), 5-10, 2004
672004
Effect of preheat temperature on the orientation relationship of (Mn, Fe) Al6 precipitates in an AA 5182 Aluminium—Magnesium alloy
P Ratchev, B Verlinden, P Van Houtte
Acta metallurgica et materialia 43 (2), 621-629, 1995
661995
Mechanical issues of Cu-to-Cu wire bonding
J Chen, D Degryse, P Ratchev, I De Wolf
IEEE Transactions on Components and Packaging Technologies 27 (3), 539-545, 2004
562004
Direct gold and copper wires bonding on copper
HM Ho, W Lam, S Stoukatch, P Ratchev, CJ Vath III, E Beyne
Microelectronics Reliability 43 (6), 913-923, 2003
522003
Creep as a reliability problem in MEMS
R Modlinski, A Witvrouw, P Ratchev, A Jourdain, V Simons, HAC Tilmans, ...
Microelectronics Reliability 44 (9-11), 1733-1738, 2004
502004
Creep characterization of Al alloy thin films for use in MEMS applications
R Modlinski, A Witvrouw, P Ratchev, R Puers, JMJ den Toonder, I De Wolf
Microelectronic engineering 76 (1-4), 272-278, 2004
452004
Effect of cooling rate and predeformation on the precipitation hardening of an Al-4.2 wt.% Mg-0.6 wt.% Cu alloy
P Ratchev, B Verlinden, P De Smet, P Van Houtte
Scripta materialia 38 (8), 1195-1201, 1998
421998
Creep-resistant aluminum alloys for use in MEMS
R Modlinski, P Ratchev, A Witvrouw, R Puers, I De Wolf
Journal of Micromechanics and Microengineering 15 (7), S165, 2005
412005
Hot working of AA1050—relating the microstructural and textural developments
I Samajdar, P Ratchev, B Verlinden, E Aernoudt
Acta materialia 49 (10), 1759-1769, 2001
412001
On the formation of 2H stacking sequence in 18R martensite plates in a precipitate containing Cu Al Ni Ti Mn alloy
P Ratchev, J Van Humbeeck, L Delaey
Acta metallurgica et materialia 41 (8), 2441-2449, 1993
391993
Preparation and properties ofX-sialon
Y Zhou, J Vleugels, T Laoui, P Ratchev, O Van der Biest
Journal of Materials science 30 (18), 4584-4590, 1995
341995
A fundamental study of the χ-phase precipitation in CuAlNiTi (Mn) shape memory alloys
I Hurtado, P Ratchev, J Van Humbeeck, L Delaey
Acta materialia 44 (8), 3299-3306, 1996
331996
Characteristics of resistance welding of lap-shear coupons. Part III. Crystallinity
C Ageorges, L Ye, YW Mai, M Hou
Composites Part A: Applied Science and Manufacturing 29 (8), 921-932, 1998
311998
S [prime] phase precipitation in Al-4wt.% Mg-1wt.% Cu alloy
P Ratchev, B Verlinden, P Van Houtte
Scripta Metallurgica et Materialia;(United States) 30 (5), 1994
291994
Nanohardness study of CoSn/sub 2/intermetallic layers formed between CO UBM and Sn flip-chip solder joints
P Ratchev, R Labie, E Beyne
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004
212004
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