| Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling MP Gupta, MH Sayer, S Mukhopadhyay, S Kumar IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011 | 93 | 2011 |
| Array of Thermoelectric Coolers for On-Chip Thermal Management O Sullivan, MP Gupta, S Mukhopadhyay, S Kumar ASME Journal of electronic packaging 134 (2), 2012 | 43 | 2012 |
| Thermal and manufacturing design considerations for silicon-based embedded microchannel-3D manifold coolers (EMMCs): part 1—experimental study of single-phase cooling … KW Jung, E Cho, H Lee, C Kharangate, F Zhou, M Asheghi, EM Dede, ... Journal of Electronic Packaging 142 (3), 031117, 2020 | 33 | 2020 |
| Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors M Cho, N Sathe, MP Gupta, S Kumar, S Yalamanchilli, S Mukhopadhyay Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM …, 2010 | 24 | 2010 |
| On-chip Peltier cooling using current pulse MP Gupta, SS Min-hee, S Mukhopadhyay, S Kumar 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 23 | 2010 |
| High field breakdown characteristics of carbon nanotube thin film transistors MP Gupta, A Behnam, F Lian, D Estrada, E Pop, S Kumar Nanotechnology 24 (40), 405204, 2013 | 20 | 2013 |
| Self-consistent electrothermal modeling of passive and microchannel cooling in AlGaN/GaN HEMTs MP Gupta, AK Vallabhaneni, S Kumar IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 17 | 2017 |
| Impact of Thermal Boundary Conductances on Power Dissipation and Electrical Breakdown of Carbon Nano-tube Network Transistors MP Gupta, L Chen, D Estrada, A Behnam, E Pop, S Kumar Journal of Applied Physics 112 (12), 124506, 2012 | 17 | 2012 |
| Feasibility design of tight integration of low inductance sic power module with microchannel cooler H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022 | 16 | 2022 |
| On-chip power generation using ultrathin thermoelectric generators O Sullivan, MP Gupta, S Mukhopadhyay, S Kumar Journal of Electronic Packaging 137 (1), 011005, 2015 | 15 | 2015 |
| Solving nongray Boltzmann transport equation in gallium nitride AK Vallabhaneni, L Chen, MP Gupta, S Kumar Journal of Heat Transfer 139 (10), 102701, 2017 | 14 | 2017 |
| Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers T Wei, S Hazra, Y Lin, MP Gupta, M Degner, M Asheghi, KE Goodson Journal of Electronic Packaging 145 (2), 021008, 2023 | 12 | 2023 |
| Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling S Hazra, T Wei, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner International Journal of Heat and Mass Transfer 197, 123356, 2022 | 12 | 2022 |
| Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors MP Gupta, M Cho, S Mukhopadhyay, S Kumar ASME Journal of heat transfer 134 (6), 2012 | 12* | 2012 |
| Thermoelectric Coolers for Thermal Gradient Management on Chip O Sullivan, MP Gupta, S Mukhopadhyay, S Kumar IMECE, 2010 | 12 | 2010 |
| Considerations and challenges for large area embedded micro-channels with 3D manifold in high heat flux power electronics applications A Piazza, S Hazra, KW Jung, M Degner, MP Gupta, E Jih, M Asheghi, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Power Multiplexing for Thermal Field Management in Many-Core Processors M Cho, C Kersey, MP Gupta, N Sathe, S Kumar, S Yalamanchili, ... IEEE Transactions on Components Packaging and Manufacturing Technology 3 (1 …, 2013 | 11 | 2013 |
| Thermal mangament of multicore processors using power multiplexing MP Gupta, M Cho, S Mukhopadhyay, S Kumar 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 11 | 2010 |
| Multi-level embedded three-dimensional manifold microchannel heat sink of aluminum nitride direct bonded copper for the high-power electronic module Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging 146 (1), 011006, 2024 | 5 | 2024 |
| Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal S Hazra, A Piazza, KW Jung, M Asheghi, MP Gupta, E Jih, M Degner, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
Satish KumarProfessor of Mechanical Engineering, Georgia Institute of TechnologyDirección de correo verificada de me.gatech.edu
