Mukul Kumar

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Adam J SchwartzAmes LaboratoryVerified email at ameslab.gov
Wayne KingLawrence Livermore National LaboratoryVerified email at additivemfg.info
Bryan ReedChief Technology Officer, Integrated Dynamic Electron Solutions, Inc.Verified email at phaseplate.com
Nathan BartonProgram Group Leader, Lawrence Livermore National LaboratoryVerified email at llnl.gov
Vijay K VasudevanUniversity of North Texas; previously University of CincinnatiVerified email at unt.edu
Jonathan LindLawrence Livermore National LaboratoryVerified email at llnl.gov
Christopher A SchuhNorthwestern UniversityVerified email at northwestern.edu
James BelakLawrence Livermore National LaboratoryVerified email at llnl.gov
Kevin J HemkerJohns Hopkins UniversityVerified email at jhu.edu
James StölkenLawrence Livermore National LaboratoryVerified email at llnl.gov
Damian SwiftLawrence Livermore National LaboratoryVerified email at physics.org
David FieldProfessor, School of Mechanical and Materials Engineering, Washington State UniversityVerified email at wsu.edu
Eduardo M. BringaCONICET, Universidad de Mendoza, Universidad Nacional de CuyoVerified email at uncu.edu.ar
Robert E RuddLawrence Livermore National LaboratoryVerified email at llnl.gov
Vasily BulatovLawrence Livermore National LaboratoryVerified email at llnl.gov
Robert O. RitchieProfessor of Materials Science, University of California BerkeleyVerified email at lbl.gov
Shiu Fai Frankie LiSr. Manager, MLVerified email at alumni.cmu.edu
Mark C. MessnerArgonne National LaboratoryVerified email at anl.gov
justin warkProfessor of Physics, University of OxfordVerified email at physics.ox.ac.uk
K.T. RameshJohns Hopkins UniversityVerified email at jhu.edu

Mukul Kumar

Lawrence Livermore National Laboratory

Verified email at llnl.gov

Grain boundaries electron microscopy and diffraction methods shock physics metamaterials dynamic


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Electron backscatter diffraction in materials science AJ Schwartz, M Kumar, BL Adams, DP Field Springer 2, 35-52, 2009	2389	2009
An experimental investigation into additive manufacturing-induced residual stresses in 316L stainless steel AS Wu, DW Brown, M Kumar, GF Gallegos, WE King Metallurgical and Materials Transactions A 45 (13), 6260-6270, 2014	729	2014
Probing the active surface sites for CO reduction on oxide-derived copper electrocatalysts A Verdaguer-Casadevall, CW Li, TP Johansson, SB Scott, JT McKeown, ... Journal of the American Chemical Society 137 (31), 9808-9811, 2015	636	2015
Grain-boundary engineering markedly reduces susceptibility to intergranular hydrogen embrittlement in metallic materials S Bechtle, M Kumar, BP Somerday, ME Launey, RO Ritchie Acta materialia 57 (14), 4148-4157, 2009	479	2009
Analysis of grain boundary networks and their evolution during grain boundary engineering CA Schuh, M Kumar, WE King Acta Materialia 51 (3), 687-700, 2003	358	2003
Modifications to the microstructural topology in fcc materials through thermomechanical processing M Kumar, WE King, AJ Schwartz Acta Materialia 48 (9), 2081-2091, 2000	336	2000
Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials M Kumar, AJ Schwartz, WE King Acta materialia 50 (10), 2599-2612, 2002	310	2002
Grain boundary energy function for fcc metals VV Bulatov, BW Reed, M Kumar Acta Materialia 65, 161-175, 2014	295	2014
Analysis of local orientation gradients in deformed single crystals DP Field, PB Trivedi, SI Wright, M Kumar Ultramicroscopy 103 (1), 33-39, 2005	252	2005
Effect of microstructural length scales on spall behavior of copper RW Minich, JU Cazamias, M Kumar, AJ Schwartz Metallurgical and Materials Transactions A 35, 2663-2673, 2004	203	2004
High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering Y Gao, M Kumar, RK Nalla, RO Ritchie Metallurgical and Materials Transactions A 36 (12), 3325-3333, 2005	170	2005
Present state of electron backscatter diffraction and prospective developments RA Schwarzer, DP Field, BL Adams, M Kumar, AJ Schwartz Electron backscatter diffraction in materials science, 1-20, 2009	159	2009
Atomistic modeling of shock-induced void collapse in copper LP Davila, P Erhart, EM Bringa, MA Meyers, VA Lubarda, MS Schneider, ... Applied Physics Letters 86 (16), 161902, 2005	143	2005
High-cycle fatigue of nickel-base superalloy René 104 (ME3): Interaction of microstructurally small cracks with grain boundaries of known character Y Gao, JS Stölken, M Kumar, RO Ritchie Acta materialia 55 (9), 3155-3167, 2007	130	2007
Connectivity and percolation in simulated grain-boundary networks CA Schuh, RW Minich, M Kumar Philosophical Magazine 83 (6), 711-726, 2003	125	2003
Materials science under extreme conditions of pressure and strain rate BA Remington, G Bazan, J Belak, E Bringa, JD Colvin, MJ Edwards, ... Metallurgical and Materials Transactions A 35, 2587-2607, 2004	120	2004
Atomistic mechanism of shock-induced void collapse in nanoporous metals P Erhart, EM Bringa, M Kumar, K Albe Physical Review B—Condensed Matter and Materials Physics 72 (5), 052104, 2005	89	2005
The α→ ϵ phase transition in iron at strain rates up to∼ 109 s− 1 JC Crowhurst, BW Reed, MR Armstrong, HB Radousky, JA Carter, ... Journal of Applied Physics 115 (11), 113506, 2014	85	2014
Ordering reactions in an Ni-25Mo-8Cr alloy M Kumar, VK Vasudevan Acta materialia 44 (4), 1591-1600, 1996	84	1996
Dynamic behavior of engineered lattice materials JA Hawreliak, J Lind, B Maddox, M Barham, M Messner, N Barton, ... Scientific reports 6, 28094, 2016	83	2016

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