Jan Vaes
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3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ...
2006 International Electron Devices Meeting, 1-4, 2006
Method for producing interconnect structures for integrated circuits
C Huyghebaert, J Vaes, J Van Olmen
US Patent 8,252,659, 2012
3D stacked IC demonstration using a through silicon via first approach
J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
Crystalline thin‐foil silicon solar cells: where crystalline quality meets thin‐film processing
F Dross, K Baert, T Bearda, J Deckers, V Depauw, O El Daif, I Gordon, ...
Progress in Photovoltaics: Research and Applications 20 (6), 770-784, 2012
Copper plating for 3D interconnects
A Radisic, O Lühn, HGG Philipsen, Z El-Mekki, M Honore, S Rodet, ...
Microelectronic Engineering 88 (5), 701-704, 2011
Integration challenges of copper through silicon via (TSV) metallization for 3D-stacked IC integration
J Van Olmen, C Huyghebaert, J Coenen, J Van Aelst, E Sleeckx, ...
Microelectronic Engineering 88 (5), 745-748, 2011
The role of metal hydroxides in NiFe deposition
J Vaes, J Fransaer, JP Celis
Journal of the Electrochemical Society 147 (10), 3718, 2000
Three novel ways of making thin-film crystalline-silicon layers on glass for solar cell applications
I Gordon, F Dross, V Depauw, A Masolin, Y Qiu, J Vaes, D Van Gestel, ...
Solar Energy Materials and Solar Cells 95, S2-S7, 2011
Recent advances in industrial CO2 electroreduction
OG Sánchez, YY Birdja, M Bulut, J Vaes, T Breugelmans, D Pant
Current Opinion in Green and Sustainable Chemistry 16, 47-56, 2019
Epoxy-induced spalling of silicon
R Martini, M Gonzalez, F Dross, A Masolin, J Vaes, D Frederickx, ...
Energy Procedia 27, 567-572, 2012
Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications
L Haspeslagh, J De Coster, OV Pedreira, I De Wolf, B Du Bois, A Verbist, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
Solvents and supporting electrolytes in the electrocatalytic reduction of CO2
M König, J Vaes, E Klemm, D Pant
Iscience 19, 135-160, 2019
CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device
S Severi, J Heck, TKA Chou, N Belov, JS Park, D Harrar, A Jain, ...
TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009
Cathodic inhibition effects during NiFe and ZnNi alloy deposition
J Vaes, J Fransaer, JP Celis
Journal of the Electrochemical Society 149 (11), C567, 2002
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
M Nagar, J Vaes, Y Ein-Eli
Electrochimica acta 55 (8), 2810-2816, 2010
SLiM-Cut thin silicon wafering with enhanced crack and stress control
J Vaes, A Masolin, A Pesquera, F Dross
Next Generation (Nano) Photonic and Cell Technologies for Solar Energy …, 2010
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry
M Nagar, D Starosvetsky, J Vaes, Y Ein-Eli
Electrochimica acta 55 (10), 3560-3571, 2010
Impact of Cu contacts on front-end performance: a projection towards 22nm node
S Demuynck, A Nackaerts, T Chiarella, J Ramos, Z Tokei, J Vaes, ...
2006 International Interconnect Technology Conference, 178-180, 2006
Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration
K De Munck, J Vaes, L Bogaerts, P De Moor, C Van Hoof, B Swinnen
MRS Online Proceedings Library Archive 970, 2006
Advanced production challenges for automated ultra-thin wafer handling
T Giesen, R Wertz, C Fischmann, G Kreck, J Govaerts, J Vaes, ...
Proc. 27th Eur. Photovoltaic Sol. Energy Conf. Exhib., 1165-1170, 2012
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Artículos 1–20