| Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue L Yin, L Wentlent, LL Yang, B Arfaei, A Oasaimeh, P Borgesen Journal of electronic materials 41, 241-252, 2012 | 156 | 2012 |
| New module efficiency record: 23.5% under 1-sun illumination using thin-film single-junction GaAs solar cells LS Mattos, SR Scully, M Syfu, E Olson, L Yang, C Ling, BM Kayes, G He 2012 38th IEEE photovoltaic specialists conference, 003187-003190, 2012 | 44 | 2012 |
| On the complete breakdown of Miner's rule for lead free BGA joints L Yang, V Raghavan, B Roggeman, L Yin, P Borgesen Proc. SMTA Int 2, 689-696, 2009 | 25 | 2009 |
| On the assessment of the life of SnAgCu solder joints in cycling with varying amplitudes L Yang, L Yin, B Arafei, B Roggeman, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 24 | 2013 |
| Recrystallization behavior of lead free and lead containing solder in cycling A Qasaimeh, Y Jaradat, L Wentlent, L Yang, L Yin, B Arfaei, P Borgesen 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1775-1781, 2011 | 23 | 2011 |
| Effects of microstructure evolution on damage accumulation in lead-free solder joints L Yang, L Yin, B Roggeman, P Borgesen 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 19 | 2010 |
| Damage accumulation in Pb-free solder joints for complex loading histories P Borgesen, L Yang, B Arfaei, L Yin, B Roggeman, M Meilunas Proc. SMTA Pan Pacific Microelectronics Symposium, 2011 | 15 | 2011 |
| A Mechanistically Justified Model for Life of SnAgCu Solder Joints in Thermal Cycling P Borgesen, L Yang, A Qasaimeh, B Arfaei, L Yin, M Meilunas, M Anselm SMTA Pan Pac Symposium, 2013 | 10 | 2013 |
| Fuzzy logic based handover in MC-CDMA system L Yang, Z Huang, W Wang 2005 IEEE International Symposium on Circuits and Systems (ISCAS), 5158-5161, 2005 | 9 | 2005 |
| Dynamic Recrystallization in Pb-free Solder Joints during Fatigue Tests L Yin, L Wentlent, L Yang, B Arfaei, A Oasaimeh, P Borgesen Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011 | 4 | 2011 |
| Parallel hybrid ARQ for OFDM based broadband wireless packet access Z Jinwen, Y Linlin, W Wenbao, L Yuan'an 2004 International Conference on Communications, Circuits and Systems (IEEE …, 2004 | 4 | 2004 |
| Nozzle Technology for Lead Free Selective Soldering U Marquez, L Yang, D Barbini SMTA International Conference, 2009 | | 2009 |
| Developing a Reflow Process for SnCuNi Solder Paste U Marquez, L Yang, D Barbini, B Roggeman, M Meilunas Pan Pacific Microelectronics Symposium, 2009 | | 2009 |
| 宽带无线蜂窝系统中的模糊逻辑切换算法分析 杨琳琳， 黄振安， 王文博 2004’中国通信学会无线及移动通信委员会学术年会论文集, 2004 | | 2004 |
