| Low partial pressure chemical vapor deposition of graphene on copper J Sun, N Lindvall, MT Cole, KTT Angel, T Wang, KBK Teo, DHC Chua, ... IEEE transactions on nanotechnology 11 (2), 255-260, 2011 | 102 | 2011 |
| A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ... Nanotechnology 23 (4), 045304, 2012 | 94 | 2012 |
| Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide J Sun, N Lindvall, MT Cole, T Wang, TJ Booth, P Bøggild, KBK Teo, J Liu, ... Journal of Applied Physics 111 (4), 2012 | 90 | 2012 |
| Carbon-nanotube through-silicon via interconnects for three-dimensional integration. T Wang, K Jeppson, L Ye, J Liu Small (Weinheim an der Bergstrasse, Germany) 7 (16), 2313-2317, 2011 | 88 | 2011 |
| Through-silicon vias filled with densified and transferred carbon nanotube forests T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu IEEE Electron Device Letters 33 (3), 420-422, 2012 | 87 | 2012 |
| Through silicon vias filled with planarized carbon nanotube bundles T Wang, K Jeppson, N Olofsson, EEB Campbell, J Liu Nanotechnology 20 (48), 485203, 2009 | 77 | 2009 |
| Ultrafast transfer of metal-enhanced carbon nanotubes at low temperature for large-scale electronics assembly Y Fu, Y Qin, T Wang, S Chen, J Liu Adv. Mater 22 (44), 5039-5042, 2010 | 70 | 2010 |
| Direct photolithographic patterning of electrospun films for defined nanofibrillar microarchitectures B Carlberg, T Wang, J Liu Langmuir 26 (4), 2235-2239, 2010 | 61 | 2010 |
| Dry densification of carbon nanotube bundles T Wang, K Jeppson, J Liu Carbon 48 (13), 3795-3801, 2010 | 52 | 2010 |
| Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive T Wang, B Carlberg, M Jönsson, GH Jeong, EEB Campbell, J Liu Applied Physics Letters 91 (9), 2007 | 45 | 2007 |
| mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application D Jiang, T Wang, S Chen, L Ye, J Liu Microelectronic Engineering 103, 177-180, 2013 | 43 | 2013 |
| Polymer‐metal nano‐composite films for thermal management B Carlberg, T Wang, J Liu, D Shangguan Microelectronics International 26 (2), 28-36, 2009 | 42 | 2009 |
| 3D stacking induced mechanical stress effects V Cherman, G Van der Plas, J De Vos, A Ivankovic, M Lofrano, V Simons, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 309-315, 2014 | 36 | 2014 |
| Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs T Wang, R Daily, G Capuz, C Gerets, KJ Rebibis, A Miller, G Beyer, ... Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 31 | 2014 |
| Formation of three-dimensional carbon nanotube structures by controllable vapor densification T Wang, D Jiang, S Chen, K Jeppson, L Ye, J Liu Materials Letters 78, 184-187, 2012 | 31 | 2012 |
| Recent progress of thermal interface materials J Liu, T Wang, B Carlberg, M Inoue 2008 2nd Electronics System-Integration Technology Conference, 351-358, 2008 | 31 | 2008 |
| Carbon nanotubes for electronics manufacturing and packaging: From growth to integration J Liu, D Jiang, Y Fu, T Wang Advances in Manufacturing 1, 13-27, 2013 | 30 | 2013 |
| Warpage prediction and optimization for embedded silicon fan-out wafer-level packaging based on an extended theoretical model C Chen, D Yu, T Wang, Z Xiao, L Wan IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (5 …, 2019 | 28 | 2019 |
| Nanostructured polymer-metal composite for thermal interface material applications B Carlberg, T Wang, Y Fu, J Liu, D Shangguan 2008 58th Electronic Components and Technology Conference, 191-197, 2008 | 28 | 2008 |
| A study of CFD simulation for on-chip cooling with 2D CNT micro-fin array X Zhong, Y Fan, J Liu, Y Zhang, T Wang, Z Cheng 2007 International Symposium on High Density packaging and Microsystem …, 2007 | 28 | 2007 |
