| Demystifying 3D ICs: The pros and cons of going vertical WR Davis, J Wilson, S Mick, J Xu, H Hua, C Mineo, AM Sule, M Steer, ... IEEE design & test of computers 22 (6), 498-510, 2005 | 1262 | 2005 |
| FreePDK: An open-source variation-aware design kit JE Stine, I Castellanos, M Wood, J Henson, F Love, WR Davis, ... 2007 IEEE international conference on Microelectronic Systems Education (MSE …, 2007 | 476 | 2007 |
| Design and CAD for 3D integrated circuits PD Franzon, WR Davis, MB Steer, S Lipa, EC Oh, T Thorolfsson, ... Proceedings of the 45th annual Design Automation Conference, 668-673, 2008 | 251 | 2008 |
| A design environment for high-throughput low-power dedicated signal processing systems WR Davis, N Zhang, K Camera, D Markovic, T Smilkstein, MJ Ammer, ... IEEE Journal of Solid-State Circuits 37 (3), 420-431, 2002 | 168 | 2002 |
| A 500-Mb/s soft-output Viterbi decoder E Yeo, SA Augsburger, WR Davis, B Nikolic IEEE Journal of Solid-State Circuits 38 (7), 1234-1241, 2003 | 88 | 2003 |
| FreePDK15: An open-source predictive process design kit for 15nm FinFET technology K Bhanushali, WR Davis Proceedings of the 2015 Symposium on International Symposium on Physical …, 2015 | 86 | 2015 |
| Exploring compromises among timing, power and temperature in three-dimensional integrated circuits H Hua, C Mineo, K Schoenfliess, A Sule, S Melamed, R Jenkal, WR Davis Proceedings of the 43rd annual Design Automation Conference, 997-1002, 2006 | 60 | 2006 |
| Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies WR Davis, EC Oh, AM Sule, PD Franzon IEEE transactions on very large scale integration (VLSI) systems 17 (4), 496-506, 2009 | 37 | 2009 |
| Rationale for a 3D heterogeneous multi-core processor E Rotenberg, BH Dwiel, E Forbes, Z Zhang, R Widialaksono, ... 2013 IEEE 31st International Conference on Computer Design (ICCD), 154-168, 2013 | 36 | 2013 |
| Inter-die signaling in three dimensional integrated circuits C Mineo, R Jenkal, S Melamed, WR Davis 2008 IEEE Custom Integrated Circuits Conference, 655-658, 2008 | 34 | 2008 |
| Wireless systems-on-a-chip design RW Brodersen, WR Davis, D Yee, N Zhang 2001 International Symposium on VLSI Technology, Systems, and Applications …, 2001 | 30 | 2001 |
| Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring S Melamed, T Thorolfsson, TR Harris, S Priyadarshi, P Franzon, MB Steer, ... IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012 | 29 | 2012 |
| Creating 3D specific systems: Architecture, design and CAD PD Franzon, WR Davis, T Thorolffson 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010 | 28 | 2010 |
| Junction-level thermal extraction and simulation of 3DICs S Melamed, T Thorolfsson, A Srinivasan, E Cheng, P Franzon, R Davis 2009 IEEE International Conference on 3D System Integration, 1-7, 2009 | 27 | 2009 |
| Implementation of high throughput soft output Viterbi decoders E Yeo, SA Augsburger, WR Davis, B Nikolic IEEE Workshop on Signal Processing Systems, 146-151, 2002 | 21 | 2002 |
| Selection of replacement therapy for patients with severe factor VII deficiency JF Kelleher Jr, E Gomperts, W Davis, R Steingart, R Miller, J Bessette Journal of Pediatric Hematology/Oncology 8 (4), 318-323, 1986 | 20 | 1986 |
| Leakage power contributor modeling N Dhanwada, D Hathaway, J Frenkil, WR Davis, H Demircioglu IEEE Design & Test of Computers 29 (2), 71-78, 2012 | 18 | 2012 |
| Automated design space exploration for DSP applications R Hourani, R Jenkal, WR Davis, W Alexander Journal of Signal Processing Systems 56, 199-216, 2009 | 18 | 2009 |
| A transient electrothermal analysis of three-dimensional integrated circuits TR Harris, S Priyadarshi, S Melamed, C Ortega, R Manohar, SR Dooley, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2012 | 17 | 2012 |
| Design for 3D integration and applications PD Franzon, WR Davis, MB Steer, H Hao, S Lipa, S Luniya, C Mineo, J Oh, ... 2007 International Symposium on Signals, Systems and Electronics, 263-266, 2007 | 16 | 2007 |
