Seguir
Qinghuang Lin
Qinghuang Lin
Director, Technology Development Center, ASML US
Dirección de correo verificada de asml.com
Título
Citado por
Citado por
Año
Method for air gap interconnect integration using photo-patternable low k material
LA Clevenger, M Darnon, Q Lin, AD Lisi, SV Nitta
US Patent 8,241,992, 2012
3222012
Modeling line edge roughness effects in sub 100 nanometer gate length devices
P Oldiges, Q Lin, K Petrillo, M Sanchez, M Ieong, M Hargrove
2000 International Conference on Simulation of Semiconductor Processes and …, 2000
2012000
Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
Q Lin, M Angelopoulos, AD Katnani, R Sooriyakumaran
US Patent 6,087,064, 2000
1512000
Patternable low dielectric constant materials and their use in ULSI interconnection
Q Lin, R Sooriyakumaran
US Patent 7,041,748, 2006
1372006
Measurement of bandgap energies in low-k organosilicates
MT Nichols, W Li, D Pei, GA Antonelli, Q Lin, S Banna, Y Nishi, JL Shohet
Journal of Applied Physics 115 (9), 2014
1362014
Small angle x-ray scattering metrology for sidewall angle and cross section of nanometer scale line gratings
T Hu, RL Jones, W Wu, EK Lin, Q Lin, D Keane, S Weigand, J Quintana
Journal of Applied Physics 96 (4), 1983-1987, 2004
972004
Effect of drawing on structure and properties of a liquid crystalline polymer and polycarbonate insitu composite
Q Lin, J Jho, AF Yee
Polymer Engineering & Science 33 (13), 789-798, 1993
911993
Airgap-containing interconnect structure with patternable low-k material and method of fabricating
Q Lin
US Patent 8,476,758, 2013
802013
Phase transformations of a liquid crystalline epoxy during curing
Q Lin, AF Yee, JD Earls, RE Hefner Jr, HJ Sue
Polymer 35 (12), 2679-2682, 1994
761994
Toward controlled resist line-edge roughness: material origin of line-edge roughness in chemically amplified positive-tone resists
Q Lin, R Sooriyakumaran, WS Huang
Advances in Resist Technology and Processing XVII 3999, 230-239, 2000
712000
Resist composition and process of forming a patterned resist layer on a substrate
Q Lin, TM Hughes, GM Jordhamo, AD Katnani, WM Moreau, N Patel
US Patent 6,210,856, 2001
692001
Evolution of structure and properties of a liquid crystalline epoxy during curing
Q Lin, AF Yee, HJ Sue, JD Earls, RE Hefner Jr
Journal of Polymer Science Part B: Polymer Physics 35 (14), 2363-2378, 1997
691997
Scalable nanostructured carbon electrode arrays for enhanced dopamine detection
S Demuru, L Nela, N Marchack, SJ Holmes, DB Farmer, GS Tulevski, ...
ACS sensors 3 (4), 799-805, 2018
622018
Quantifying the stress relaxation modulus of polymer thin films via thermal wrinkling
EP Chan, S Kundu, Q Lin, CM Stafford
ACS applied materials & interfaces 3 (2), 331-338, 2011
602011
A water-castable, water-developable chemically amplified negative-tone resist
Q Lin, T Steinhäusler, L Simpson, M Wilder, DR Medeiros, CG Willson, ...
Chemistry of materials 9 (8), 1725-1730, 1997
581997
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
C Wang, SW Nam, JM Cotte, CV Jahnes, EG Colgan, RL Bruce, M Brink, ...
Nature communications 8 (1), 14243, 2017
522017
Photopatternable dielectric materials for BEOL applications and methods for use
RD Allen, PJ Brock, BW Davis, Q Lin, RD Miller, A Nelson, ...
US Patent 8,029,971, 2011
522011
Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures
RD Allen, PJ Brock, BW Davis, WSS Huang, Q Lin, A Nelson, ...
US Patent 7,709,370, 2010
502010
Design of photoresists with reduced environmental impact. 1. Water-soluble resists based on photo-cross-linking of poly (vinyl alcohol)
JM Havard, SY Shim, JMJ Fréchet, Q Lin, DR Medeiros, CG Willson, ...
Chemistry of materials 11 (3), 719-725, 1999
501999
Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
Q Lin, M Angelopoulos, AD Katnani, R Sooriyakumaran
US Patent 6,340,734, 2002
462002
El sistema no puede realizar la operación en estos momentos. Inténtalo de nuevo más tarde.
Artículos 1–20