Seguir
Hobin Jeong
Título
Citado por
Citado por
Año
Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer
H Lee, H Lee, H Jeong, S Choi, Y Lee, M Jeong, H Jeong
Journal of Nanoscience and Nanotechnology 12 (2), 1256-1259, 2012
502012
Polypyrrole films with micro/nanosphere shapes for electrodes of high-performance supercapacitors
JK Lee, H Jeong, R Lassarote Lavall, A Busnaina, Y Kim, YJ Jung, ...
ACS applied materials & interfaces 9 (38), 33203-33211, 2017
312017
High‐Rate Nanoscale Offset Printing Process Using Directed Assembly and Transfer of Nanomaterials
H Cho, S Somu, JY Lee, H Jeong, A Busnaina
Advanced materials 27 (10), 1759-1766, 2015
302015
Planarization of wafer edge profile in chemical mechanical polishing
Y Park, H Jeong, S Choi, H Jeong
International Journal of Precision Engineering and Manufacturing 14, 11-15, 2013
222013
Prediction of real contact area from microtopography on CMP pad
H Jeong, H Lee, S Choi, Y Lee, H Jeong
Journal of Advanced Mechanical Design, Systems, and Manufacturing 6 (1), 113-120, 2012
162012
Fabrication of organic field effect transistors using directed assembled and transfer printed carbon nanotube source/drain electrodes
Z Chai, H Jeong, SA Abbasi, AA Busnaina
Applied Physics Letters 114 (10), 2019
132019
Solution processed all-carbon transistors via directed assembly and transfer printing of CNT channel and electrodes
WH Wang, SA Abbasi, Z Chai, H Jeong, A Busnaina
Applied physics letters 117 (13), 2020
32020
Effect of Current Density on Material Removal in Cu ECMP
E Park, H Lee, H Jeong, H Jeong
Tribology and Lubricants 31 (3), 79-85, 2015
32015
Development of Directed-Assembly Based Printing Process for Electronics, Sensing, and Material Application
H Jeong
Northeastern University, 2017
12017
Effect of Pad Wear on Stress Distribution in CMP Process
SH Choi, HS Lee, MK Jeong, HB Jeong, HJ Lee, HH Jo, HD Jeong
Proceedings of the Korean Society of Precision Engineering Conference, 123-124, 2010
12010
Damascene template for nanoelement printing fabricated without chemomechanical planarization
H Jeong, A Busnaina
US Patent 11,156,914, 2021
2021
Highly engineered pyrrole micro-loop arrays for high-capacitance supercapacitor
JK Lee, H Jeong, A Busnaina, YJ Jung, HY Lee
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 252, 2016
2016
AFM detection of an Alzheimer marker: Different stages of amyloid beta peptide on a mica substrate
JK Lee, H Jeong, C Bubar, A Busnaina, HY Lee
Journal of the Korean Physical Society 67, 1957-1960, 2015
2015
Wafer Edge Profile Control for Improvement of Removal Uniformity in Oxide CMP
SH Choi, HB Jeong, YB Park, HJ Lee, HJ Kim, HD Jeong
Journal of the Korean Society for Precision Engineering 29 (3), 289-294, 2012
2012
El sistema no puede realizar la operación en estos momentos. Inténtalo de nuevo más tarde.
Artículos 1–14