| An autonomous sigfox wireless sensor node for environmental monitoring L Joris, F Dupont, P Laurent, P Bellier, S Stoukatch, JM Redouté IEEE Sensors Letters 3 (7), 01-04, 2019 | 77 | 2019 |
| Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials P Laurent, S Stoukatch, F Dupont, M Kraft Microelectronic Engineering 197, 67-75, 2018 | 15 | 2018 |
| Low-cost microfluidic device micromachining and sequential integration with SAW sensor intended for biomedical applications S Stoukatch, LA Francis, F Dupont, M Kraft Sensors and Actuators A: Physical 319, 112526, 2021 | 12 | 2021 |
| 355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration F Dupont, S Stoukatch, P Laurent, S Dricot, M Kraft Optics and Lasers in Engineering 100, 186-194, 2018 | 12 | 2018 |
| Additive low temperature 3D printed electronic as enabling technology for IoT application S Stoukatch, F Dupont, L Seronveaux, D Vandormael, M Kraft 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-6, 2017 | 11 | 2017 |
| Preparation and characterization of a thermal insulating carbon xerogel-epoxy composite adhesive for electronics applications JF Fagnard, S Stoukatch, P Laurent, F Dupont, C Wolfs, SD Lambert, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 10 | 2021 |
| Fine pitch features laser direct patterning on flexible printed circuit board F Dupont, S Stoukatch, P Laurent, JM Redouté Optics and Lasers in Engineering 126, 105869, 2020 | 10 | 2020 |
| Smart-shoe self-powered by walking G Colson, P Laurent, P Bellier, S Stoukatch, F Dupont, M Kraft 2017 IEEE 14th International Conference on Wearable and Implantable Body …, 2017 | 9 | 2017 |
| Autonomous micro-platform for multisensors with an advanced power management unit (PMU) P Bellier, P Laurent, S Stoukatch, F Dupont, L Joris, M Kraft Journal of Sensors and Sensor Systems 7 (1), 299-308, 2018 | 8 | 2018 |
| Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors S Stoukatch, JF Fagnard, F Dupont, P Laurent, M Debliquy, JM Redouté IEEE Access 10, 19242-19253, 2022 | 5 | 2022 |
| A novel QCM mass sensing system incorporated with a 3-Dof mode localized coupled resonator stiffness sensor Y Wang, C Wang, C Zhao, H Liu, D Cerica, M Baijot, F Dupont, ... 2019 20th International Conference on Solid-State Sensors, Actuators and …, 2019 | 4 | 2019 |
| Low-temperature packaging methods as a key enablers for microsystems assembly and integration S Stoukatch, F Dupont, M Kraft 2018 International Semiconductor Conference (CAS), 115-118, 2018 | 4 | 2018 |
| Device processing challenges for miniaturized sensing systems targeting biological fluids S Stoukatch, F Dupont, JM Redouté Biomedical Materials & Devices 1 (1), 82-98, 2023 | 3 | 2023 |
| Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization S Stoukatch, F Dupont, P Laurent, JM Redouté Materials 16 (18), 6202, 2023 | 2 | 2023 |
| Optimization of the power flow generated by an AC energy harvester for variable operating conditions P Laurent, JF Fagnard, F Dupont, JM Redouté IEEE Transactions on Circuits and Systems I: Regular Papers 69 (6), 2625-2636, 2022 | 2 | 2022 |
| Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor S Stoukatch, JF Fagnard, F Dupont, P Laurent, JM Redouté 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 483-487, 2021 | 2 | 2021 |
| Ultra-low power microsystems integrated P Laurent, F Dupont, S Stoukatch, F Axisa Smart Systems Integration Conf.(SSI2015), 2015 | 2 | 2015 |
| Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components S Stoukatch, M Debliquy, F Dupont, JM Redouté Micromachines 14 (12), 2197, 2023 | 1 | 2023 |
| A Wireless Low-Power Single-Unit Wearable System for Continuous Early Warning Score Calculation P Bellier, D Coppieters’t Wallant, H van den Bongarth, W Bijnens, J Aarts, ... IEEE Sensors Journal 23 (11), 12171-12180, 2023 | 1 | 2023 |
| Thermal conductivity characterization of an in-house formulated thermal insulating xerogel-epoxy composite adhesive for electronics applications S Stoukatch, JF Fagnard, G Roy, P Laurent, F Dupont, PJ Jacques, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 1 | 2022 |
